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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1-of-8 Decoder/Demultiplexer High-Performance Silicon-Gate CMOS
The MC54/74HC138A is identical in pinout to the LS138. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. The HC138A decodes a three-bit Address to one-of-eight active-low outputs. This device features three Chip Select inputs, two active-low and one active-high to facilitate the demultiplexing, cascading, and chip-selecting functions. The demultiplexing function is accomplished by using the Address inputs to select the desired device output; one of the Chip Selects is used as a data input while the other Chip Selects are held in their active states. * Output Drive Capability: 10 LSTTL Loads * Outputs Directly Interface to CMOS, NMOS and TTL * Operating Voltage Range: 2.0 to 6.0 V * Low Input Current: 1.0 A * High Noise Immunity Characteristic of CMOS Devices * In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 100 FETs or 29 Equivalent Gates LOGIC DIAGRAM
1 2 3 15
MC54/74HC138A
16 1
J SUFFIX CERAMIC PACKAGE CASE 620-10
16 1
N SUFFIX PLASTIC PACKAGE CASE 648-08
16 1
D SUFFIX SOIC PACKAGE CASE 751B-05
16 1
DT SUFFIX TSSOP PACKAGE CASE 948F-01
ORDERING INFORMATION MC54HCXXXAJ MC74HCXXXAN MC74HCXXXAD MC74HCXXXADT ACTIVE-LOW OUTPUTS Ceramic Plastic SOIC TSSOP
A0 ADDRESS INPUTS A1 A2
Y0
14 Y1 13 Y2 12 Y3 11 Y4 10 Y5 9 Y6 7 Y7
PIN ASSIGNMENT
A0 A1 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC Y0 Y1 Y2 Y3 Y4 Y5 Y6
CHIP- SELECT INPUTS
CS1 CS2 CS3
6 4 5 PIN 16 = VCC PIN 8 = GND
A2 CS2 CS3 CS1 Y7
FUNCTION TABLE
Inputs X X L H H H H H H H H X H X L L L L L L L L H X X L L L L L L L L X X X L L L L H H H H X X X L L H H L L H H X X X L H L H L H L H H H H L H H H H H H H H H H H L H H H H H H H H H H H L H H H H H Outputs H H H H H H L H H H H H H H H H H H L H H H H H H H H H H H L H H H H H H H H H H H L H H H H H H H H H H H L CS1CS2 CS3 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
GND
H = high level (steady state); L = low level (steady state); X = don't care
10/95
(c) Motorola, Inc. 1995
1
REV 6
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* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_ C from 65_ to 125_ C Ceramic DIP: - 10 mW/_ C from 100_ to 125_ C SOIC Package: - 7 mW/_ C from 65_ to 125_ C TSSOP Package: - 6.1 .W/_ C from 65_ to 125_ C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
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MAXIMUM RATINGS*
MOTOROLA
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
RECOMMENDED OPERATING CONDITIONS
MC54/74HC138A
Symbol
Vin, Vout
Symbol
Symbol
VCC
Vout
Tstg
ICC
Iout
VCC
Vin
PD
TL
VOH
tr, tf
Iin
TA
VIH
VIL
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP Package) (Ceramic DIP)
Storage Temperature
Power Dissipation in Still Air, Plastic or Ceramic DIP SOIC Package TSSOP Package
DC Supply Current, VCC and GND Pins
DC Output Current, per Pin
DC Input Current, per Pin
DC Output Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Input Rise and Fall Time (Figure 2)
Operating Temperature, All Package Types
DC Input Voltage, Output Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Minimum High-Level Output Voltage
Maximum Low-Level Input Voltage
Minimum High-Level Input Voltage
Parameter
Parameter
Parameter
Vin = VIH or VIL |Iout| 20 A
Vin = VIH or VIL |Iout| |Iout| |Iout|
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
v
v
v
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
Test Conditions
- 0.5 to VCC + 0.5
- 0.5 to VCC + 0.5
- 65 to + 150
- 0.5 to + 7.0
2 - 55 Min 2.0 Value
v 2.4 mA v 4.0 mA v 5.2 mA
0 0 0
0
50
25
20
260 300
750 500 450
+ 125
1000 500 400
VCC
Max
6.0
VCC V
3.0 4.5 6.0
2.0 4.5 6.0
2.0 3.0 4.5 6.0
2.0 3.0 4.5 6.0
Unit
Unit
mW
mA
mA
mA
_C
_C
_C
ns
V
V
V
V
V
-55_ C to 25_ C
0.5 0.9 1.35 1.8
1.5 2.1 3.15 4.2
2.48 3.98 5.48
1.9 4.4 5.9
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Guaranteed Limit
v 85_ C v 125_ C
High-Speed CMOS Logic Data DL129 -- Rev 6 0.5 0.9 1.35 1.8 1.5 2.1 3.15 4.2 2.34 3.84 5.34 1.9 4.4 5.9
v
0.5 0.9 1.35 1.8
1.5 2.1 3.15 4.2
2.20 3.70 5.20 1.9 4.4 5.9
v
Unit
V V V
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NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High- Speed CMOS Data Book (DL129/D). NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
High-Speed CMOS Logic Data DL129 -- Rev 6 Symbol Symbol tPLH, tPHL tPLH, tPHL tPLH, tPHL tTLH, tTHL VOL CPD ICC Cin Iin Maximum Quiescent Supply Current (per Package) Maximum Input Leakage Current Maximum Low-Level Output Voltage Power Dissipation Capacitance (Per Package)* Maximum Input Capacitance Maximum Output Transition Time, Any Output (Figures 2 and 4) Maximum Propagation Delay, CS2 or CS3 to Output Y (Figures 3 and 4) Maximum Propagation Delay, CS1 to Output Y (Figures 2 and 4) Maximum Propagation Delay, Input A to Output Y (Figures 1 and 4) Parameter Parameter Vin = VIH or VIL |Iout| 20 A Vin = VCC or GND Iout = 0 A Vin = VCC or GND
* Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Vin = VIH or VIL |Iout| |Iout| |Iout|
v
Test Conditions
3
v 2.4 mA v 4.0 mA v 5.2 mA
VCC V
VCC V
2.0 3.0 4.5 6.0
2.0 3.0 4.5 6.0
2.0 3.0 4.5 6.0
2.0 3.0 4.5 6.0
6.0
6.0
3.0 4.5 6.0
2.0 4.5 6.0
--
-55_ C to 25_ C
-55_ C to 25_ C
Typical @ 25C, VCC = 5.0 V
0.1
0.26 0.26 0.26
120 90 24 20
135 90 27 23
110 85 22 19
0.1 0.1 0.1
10
75 30 15 13
4
Guaranteed Limit
Guaranteed Limit
v 85_ C v 125_ C
v 85_ C v 125_ C
1.0
0.33 0.33 0.33
150 120 30 26
140 100 28 24
170 125 34 29
0.1 0.1 0.1
10
95 40 19 16
40
55
MC54/74HC138A
1.0
0.40 0.40 0.40
180 150 36 31
165 125 33 28
205 165 41 35
160
110 55 22 19
0.1 0.1 0.1
10
MOTOROLA Unit Unit A A pF pF ns ns ns ns V
MC54/74HC138A
SWITCHING WAVEFORMS
VALID INPUT A tPLH OUTPUT Y 50% 50% tPHL OUTPUT Y tTHL VALID VCC GND INPUT CS1 tPHL 90% 50% 10% tTLH 90% 50% 10% tPLH tr tf VCC GND
Figure 1.
Figure 2.
TEST POINT tf INPUT CS2, CS3 90% 50% 10% tPHL OUTPUT Y 90% 50% 10% tTHL tTLH * Includes all probe and jig capacitance tPLH tr VCC GND DEVICE UNDER TEST OUTPUT
CL*
Figure 3.
Figure 4. Test Circuit
PIN DESCRIPTIONS
ADDRESS INPUTS A0, A1, A2 (Pins 1, 2, 3) Address inputs. These inputs, when the chip is selected, determine which of the eight outputs is active-low. CONTROL INPUTS CS1, CS2, CS3 (Pins 6, 4, 5) Chip select inputs. For CS1 at a high level and CS2, CS3 at a low level, the chip is selected and the outputs follow the Address inputs. For any other combination of CS1, CS2, and CS3, the outputs are at a logic high. OUTPUTS Y0 - Y7 (Pins 15, 14, 13, 12, 11, 10, 9, 7) Active-low Decoded outputs. These outputs assume a low level when addressed and the chip is selected. These outputs remain high when not addressed or the chip is not selected.
MOTOROLA
4
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HC138A
EXPANDED LOGIC DIAGRAM
15
Y0
14
Y1
A0
1
13
Y2
A1
2
12
Y3
11 A2 3 10 CS3 CS2 5 4 9
Y4
Y5
Y6
7
Y7
CS1
6
High-Speed CMOS Logic Data DL129 -- Rev 6
5
MOTOROLA
MC54/74HC138A
OUTLINE DIMENSIONS
-A -
16 9
J SUFFIX CERAMIC PACKAGE CASE 620-10 ISSUE V
-B - C L
1
8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIM F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. INCHES MIN MAX 0.750 0.785 0.240 0.295 -- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 15 0 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 -- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 15 0 1.01 0.51
-T
SEATING - PLANE
N E F G D 16 PL 0.25 (0.010)
M
K M J 16 PL 0.25 (0.010)
M
TB
S
TA
S
DIM A B C D E F G J K L M N
-A -
16 9
N SUFFIX PLASTIC PACKAGE CASE 648-08 ISSUE R
B
1
8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MILLIMETERS MIN MAX MIN MAX 0.740 0.770 18.80 19.55 6.35 0.250 0.270 6.85 3.69 0.145 0.175 4.44 0.39 0.015 0.021 0.53 1.02 0.040 0.070 1.77 0.100 BSC 2.54 BSC 0.050 BSC 1.27 BSC 0.21 0.008 0.015 0.38 2.80 0.110 0.130 3.30 7.50 0.295 0.305 7.74 0 0 10 10 0.020 0.040 0.51 1.01
F S
C
L
-T - H G D 16 PL 0.25 (0.010)
M
SEATING PLANE
K
J TA
M
M
-A -
16 9
D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J
-B -
1 8
P 8 PL 0.25 (0.010)
M
B
M
G F
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019
K C -T SEATING -
PLANE
R X 45
M D 16 PL 0.25 (0.010)
M
J
T
B
S
A
S
MOTOROLA
6
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HC138A
OUTLINE DIMENSIONS
DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948F-01 ISSUE O
16X K REF
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
K
K1
2X
L/2
16
9
J1 B -U-
L
PIN 1 IDENT. 1 8
SECTION N-N J
N 0.25 (0.010) 0.15 (0.006) T U
S
A -V- N F DETAIL E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 _ _
M
DIM A B C D F G H J J1 K K1 L M
C 0.10 (0.004) -T- SEATING
PLANE
H D G
DETAIL E
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
How to reach us: USA/EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 MFAX: RMFAX0@email.sps.mot.com -TOUCHTONE (602) 244-6609 INTERNET: http://Design-NET.com
JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
High-Speed CMOS Logic Data DL129 -- Rev 6
CODELINE
7
*MC54/74HC138A/D*
EE CC EE CC EE CC EE CC
-W-
MC54/74HC138A/D MOTOROLA


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